08-6810-90C
261898
CONN IC DIP SOCKET 8POS GOLD
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Active|Type:DIP, 0.6"(15.24mm) Row Spacing|Number of Positions or Pins (Grid):8 (2 x 4)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:30.0µin (0.76µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole, Right Angle, Vertical|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Tin|Contact Finish Thickness - Post:200.0µin (5.08µm)|Contact Material - Post:Brass|Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled|Operating Temperature:-