100-020-051
1680334
CONN IC DIP SOCKET 20POS GOLD
Country of Origin
3M
Quantity
Package:Bulk|Product Status:Obsolete|Type:DIP, 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):20 (2 x 10)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:8.00µin (0.203µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame, Seal Tape|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:Flash|Contact Material - Post:Brass|Housing Material:Polyphenylene Sulfide (PPS), Glass Filled|Operating Temperature:-65°C ~ 125°C