18-3508-212
4206965
CONN IC DIP SOCKET 18POS GOLD
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Active|Type:DIP, 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):18 (2 x 9)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:30.0µin (0.76µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Open Frame|Termination:Wire Wrap|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:10.0µin (0.25µm)|Contact Material - Post:Brass|Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled|Operating Temperature:-55°C ~ 125°C