2200-6321-9UA-1902

Package:Bulk|Product Status:Active|Type:PGA, ZIF (ZIP)|Number of Positions or Pins (Grid):200 (21 x 21)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:30.0µin (0.76µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:30.0µin (0.76µm)|Contact Material - Post:Beryllium Copper|Housing Material:Polyethersulfone (PES)|Operating Temperature:-55°C ~ 150°C