224-5809-50-0602

Package:Box|Product Status:Active|Type:SIP, ZIF (ZIP)|Number of Positions or Pins (Grid):24 (1 x 24)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:-|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:-|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:30.0µin (0.76µm)|Contact Material - Post:Beryllium Copper|Housing Material:Polysulfone (PSU), Glass Filled|Operating Temperature:-55°C ~ 125°C