24-3575-10

Package:Bulk|Product Status:Active|Type:DIP, ZIF (ZIP), 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):24 (2 x 12)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Tin|Contact Finish Thickness - Mating:200.0µin (5.08µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Tin|Contact Finish Thickness - Post:200.0µin (5.08µm)|Contact Material - Post:Beryllium Copper|Housing Material:Polyphenylene Sulfide (PPS), Glass Filled|Operating Temperature:-