28-516-10
36546
CONN IC DIP SOCKET ZIF 28POS TIN
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Obsolete|Type:DIP, ZIF (ZIP)|Number of Positions or Pins (Grid):28 (2 x 14)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Tin|Contact Finish Thickness - Mating:10.0µin (0.25µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Tin|Contact Finish Thickness - Post:10.0µin (0.25µm)|Contact Material - Post:Beryllium Copper|Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled|Operating Temperature:-