28-6551-18
4163093
CONN IC DIP SOCKET ZIF 28POS
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Active|Type:DIP, ZIF (ZIP), 0.6"(15.24mm) Row Spacing|Number of Positions or Pins (Grid):28 (2 x 14)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Nickel Boron|Contact Finish Thickness - Mating:50.0µin (1.27µm)|Contact Material - Mating:Beryllium Nickel|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Nickel Boron|Contact Finish Thickness - Post:50.0µin (1.27µm)|Contact Material - Post:Beryllium Nickel|Housing Material:Polyetheretherketone (PEEK), Glass Filled|Operating Temperature:-55°C ~ 250°C