32-3554-11
4162965
CONN IC DIP SOCKET ZIF 32POS GLD
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Active|Type:DIP, ZIF (ZIP), 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):32 (2 x 16)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:-|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:-|Contact Material - Post:Beryllium Copper|Housing Material:Polyphenylene Sulfide (PPS), Glass Filled|Operating Temperature:-