40-6556-41
4163156
CONN IC DIP SOCKET 40POS GOLD
Country of Origin
Aries Electronics
Quantity
Package:Bulk|Product Status:Active|Type:DIP, 0.6"(15.24mm) Row Spacing|Number of Positions or Pins (Grid):40 (2 x 20)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:30.0µin (0.76µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Open Frame|Termination:Solder Cup|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:10.0µin (0.25µm)|Contact Material - Post:Brass|Housing Material:Polyphenylene Sulfide (PPS), Glass Filled|Operating Temperature:-