550-10-256M20-001166

Package:Bulk|Product Status:Active|Type:BGA|Number of Positions or Pins (Grid):256 (20 x 20)|Pitch - Mating:0.050"(1.27mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:10.0µin (0.25µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.050"(1.27mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:10.0µin (0.25µm)|Contact Material - Post:Brass|Housing Material:FR4 Epoxy Glass|Operating Temperature:-55°C ~ 125°C