DIP328-011B

Series:-|Package:Bag|Product Status:Active|Type:DIP, 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):28 (2 x 14)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:10.0µin (0.25µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Open Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Tin|Contact Finish Thickness - Post:200.0µin (5.08µm)|Contact Material - Post:Brass|Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled|Operating Temperature:-