SIP1X15-011BLF

Package:Bulk|Product Status:Obsolete|Type:SIP|Number of Positions or Pins (Grid):15 (1 x 15)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:10.0µin (0.25µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Tin|Contact Finish Thickness - Post:200.0µin (5.08µm)|Contact Material - Post:Brass|Housing Material:Polyphenylene Sulfide (PPS), Glass Filled|Operating Temperature:-