XR2C-2011-N
1829608
CONN SOCKET SIP 20POS GOLD
Country of Origin
Omron Electronics Inc-EMC Div
Quantity
Package:Bulk|Product Status:Active|Type:SIP|Number of Positions or Pins (Grid):20 (1 x 20)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:10.0µin (0.25µm)|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:10.0µin (0.25µm)|Contact Material - Post:Beryllium Copper|Housing Material:Polybutylene Terephthalate (PBT), Glass Filled|Operating Temperature:-55°C ~ 125°C