XR2C-3200-HSG
2627504
CONN IC SOCKET 32POS
Country of Origin
Omron Electronics Inc-EMC Div
Quantity
Package:Bulk|Product Status:Active|Type:Housing|Number of Positions or Pins (Grid):32 (1 x 32)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:-|Contact Finish Thickness - Mating:-|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Closed Frame|Termination:Wire Wrap|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:-|Contact Finish Thickness - Post:-|Contact Material - Post:Beryllium Copper|Housing Material:Polybutylene Terephthalate (PBT), Glass Filled|Operating Temperature:-55°C ~ 125°C