XR2T-2021-N
2627553
CONN IC DIP SOCKET 20POS GOLD
Country of Origin
Omron Electronics Inc-EMC Div
Quantity
Package:Bulk;Box|Product Status:Active|Type:DIP, 0.3"(7.62mm) Row Spacing|Number of Positions or Pins (Grid):20 (2 x 10)|Pitch - Mating:0.100"(2.54mm)|Contact Finish - Mating:Gold|Contact Finish Thickness - Mating:Flash|Contact Material - Mating:Beryllium Copper|Mounting Type:Through Hole|Features:Open Frame, Seal Tape|Termination:Solder|Pitch - Post:0.100"(2.54mm)|Contact Finish - Post:Gold|Contact Finish Thickness - Post:Flash|Contact Material - Post:Beryllium Copper|Housing Material:Polybutylene Terephthalate (PBT), Glass Filled|Operating Temperature:-55°C ~ 125°C