EASIC DIAMOND MESA
SOC EQUIPMENT
It is planned to integrate a multi-core hard' processor subsystem into these upcoming devices.
EASICM N3XS
EQUIPMENT
●28 nanometer process
●Up to 52 million equivalent ASIC gates
●Up to 124 Mb dual port memory
●Up to 32 28Gbps high-speed transceivers
●Up to 32 16.3 Gbps high-speed transceivers
EASIC" N3X AND
N2X DEVICES
●28nm and 45nm process
●Up to 5 million equivalent logic gates
●Up to 15.049 kb of true dual port memory
●Up to 18 12.5 Gbps high-speed transceivers
EASICOPY"
EQUIPMENT
Provides a seamless, low-risk. path
for migrating from eASIC" N2X,
eASIC" N3X, eASIC" N3XS, or
eASIC DiamondMesa SoC devices
to lower unit cost, cell-based ASICs.
ADVANTAGE
L OWER POWER CONSUMPTION AND UNITCOST
Replacing SRAM configuration logic with
patented single-pass custom technology
and powering down unused device
structures results in significantly lower
unit cost and power consumption
compared to FPGAs.
TIME ADV ANTAGE
Because it simplifies the design process,
customizes a small amount of mask
layer, and does not need to change
the PCB of the basic FPGA design when
it is feasible, its listing and turnover
speed is significantly higher than that
of the traditional ASIC.
HIGH PERFORMANCE
The structured ASIC combines logic,
memory, DSP, high-speed memory
interface and high-speed transceiver
(up to 28 Gbps) for high-performance
data plane or control plane applications.
EXTENSIVE IP SUPPORT
Supports a variety of fully validated
eASIC ready IP cores for third-party
alliance partners.
SIMPL IFIED DESIGN FLOW
eASIC Devices eTools provides a
framework for design conversion and
verification using a combination of
in-house developed tools and
industry-standard third-party tools.
MARKET APPLICABIL ITY
EASIC- devices provide custom 123456 solutions
with low power consumption The case is suitable
for 5G wireless, military, data center acceleration,
computing, storage, machine learning reasoning,
Internet of things, machine vision and video
applications and other final market data-intensive
and I0-intensive applications.
DOCUMENT
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